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Chinese Silicon Valley locates in E-Town

chinadaily.com.cn | Updated: 2016-05-24 14:28

The Beijing Mobile E-Town Inno Center was opened in Beijing’s Economic-Technological Development Area (E-Town) on May 10.

Integrated circuit (IC) companies and organizations Chipone, Shanghai Haogu, Beijing Xinyi and the China-Europe International Technology Cooperation Industry Alliance inked agreements with the Inno Center at the opening ceremony.

The construction of the Beijing Mobile E-Town Inno Center, which started in 2010, is the result of E-Town Capital’s strategic plan: to create a sci-tech and industrial innovation eco-system with global impact. By relying on E-Town’s competitive industrial foundation and re-arranging its innovation resources, the center is expected to be “a green innovation base for international mobile and IC industries”, said one of its officials.

Covering a building area of 530,000 square meters, the center will focus on electronic information, IC, mobile internet and cloud computing projects, making it a silicon valley in China and contributing to the upgrading of industries.

Applying a “High-end, Innovative and Green” development strategy, the center will be a hub gathering innovative ideas as well as talents, and offer a supportive environment for electronic information and IC enterprises specialized in research and development, headquarter offices, hi-tech start-ups, service enterprises and overseas start-ups.

Interactions between the center and E-Town Capital and will attract more investment to its key enterprises.

The design map for the Inno Center also made its first public appearance during the opening ceremony, illustrating the industrial innovation eco-system and its potential to bring investors and entrepreneurs together to vitalize the industry.

The Mobile E-Town Inno Center: an iconic name card for E-Town, marking its transformation from “Made in E-Town” to “Made with Wisdom”. By using the best of Beijing’s talent capital, cost advantages and solid industry base, promising fields such as kernel chips, industry supply chains, research and development of terminal upgrading, a green mobile cloud, value-added services, and the Internet of Things will be widely developed.

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