Driving product innovation and industrial applications
AMD continues to push the boundaries of chip design through its Chiplet architecture, overcoming the limitations of traditional monolithic chips.
Its Ryzen AI Max series combine CPU, GPU and NPU capabilities in a single heterogeneous architecture. With power consumption of approximately 140 watts, these processors can run large AI models locally. They support more than 100 mainstream models, including DeepSeek, Qwen and Llama, and have shipped hundreds of thousands of units worldwide. In March 2026, AMD was among the first to introduce the concept of an AI agent host.
Helios, AMD's first rackscale AI reference solution, combines AMD Instinct GPUs, AMD EPYC Server CPUs and advanced networking. It features open industry standards and high-density liquid cooling to support large-scale AI computing.
AMD is also supporting China's "AI Plus" initiative by bringing AI into practical applications across industries. In healthcare, it has partnered with Zhongshan Hospital, Fudan University on local multi-department consultations and medical image analysis. In cultural heritage preservation, it has worked with Yongle Palace in Shanxi province and Shengshu Technology to explore AI-assisted mural restoration.
In June 2025, AMD launched its China industry ecosystem partnership program. The first batch of 25 partners covers five key areas: operating systems, storage, virtualization, big data and HPC, and AI. The initiative aims to accelerate AI adoption across industries.
AMD received the World Internet Conference Distinguished Contribution Award in 2024 and the IEEE 2024 Corporate Innovation Award. Its open-source ROCm software platform also received the WIC Awards for Pioneering Science and Technology in 2025. Guided by its slogan "Together We Advance", AMD will continue to drive the evolution of computing through technological innovation and ecosystem collaboration.
