Artificial intelligence has become an increasingly active connective force in the technology stack. Since releasing MiMo, its first open-source large model, Xiaomi has gradually built a model matrix covering language, multimodality, speech and embodied AI. Through full open-sourcing and MIT commercial licensing, Xiaomi has also opened its model capabilities to a wider community of developers and industry partners. Since their launch, call volume for the MiMo V2.6 and V2.5 series has continued to rise. According to OpenRouter data, MiMo series models are among the most-called models in the world and have been widely adopted by developers worldwide. Large models are therefore no longer just laboratory results, but an important link connecting technology R&D, device experiences and industry applications.
If large models make the entire ecosystem smarter, chips and operating systems together underpin the capabilities on which the ecosystem runs. After more than a decade of sustained effort, Xiaomi successfully developed the XRING O1 flagship chip, becoming the first company in the Chinese mainland and the fourth in the world to release a 3nm flagship smartphone chipset. In August 2026, three chips from the new XRING family were launched. The XRING O3 AI flagship SoC, with AI acceleration hardware built into every module , is the industry's first flagship SoC to surpass 5 million points on AnTuTu Benchmark. Meanwhile, Xiaomi HyperOS is human-centric and connects phones, tablets, watches, TVs, smart home devices and cars through a unified, converged kernel architecture, linking more than 1 billion devices.
