• Zhongguancun 2013
Zhongguancun technologies shine at MWC 2019
( chinadaily.com.cn )
Updated: 2019-03-05

The World Mobile Congress (MWC) 2019 recently took place in Barcelona, Spain. Over 2,000 technology manufacturers gathered together to showcase the latest technological achievements and innovative products of the year.

Finding themselves in a sea of 5G innovative applications, visitors of the exhibition marveled at BOE, Inspur, Unisoc, Xiaomi, CloudMinds and other Zhongguancun enterprises.

BOE introduces foldable and flexible AMOLED displays

Large terminal manufacturers launched mobile phones equipped with foldable display screens one after another.

The Mate X folding phone developed by Huawei is designed in the shape of eagle wings. With the phone being equipped with high-strength flexible AMOLED display, it can be flipped from 0 to 180 degrees.

When the phone is unfolded, it can function like a pad; once folded, it goes back to being a normal mobile phone. It is worth noticing that the display screens are not affected by folding or unfolding.

The foldable and flexible AMOLED display on X Mate that has sparked heated discussions is a BOE made product.

BOE is one of the few companies in the world that can produce flexible screens in large scale.

Currently, the world's leading BOE Chengdu 6th generation flexible AMOLED production line has been put into mass production and supplied to many renowned manufacturers. BOE is expected to bring more flexible innovative products and solutions to users around the world.

In addition, as one of the important applications of the 5G era, the combination of 8K Ultra HD display and 5G brings visitors an unprecedented visual experience. At the exhibition, BOE and the industry chain partners demonstrated 8K photographing, 8K coding and decoding, 5G network transmission and 8K live broadcasting.

Near the W Hotel in Barcelona, the 8K Ultra HD camera clearly recorded the panoramic view of the eastern coast of Barcelona, transmitted the signal to the MWC venue in 5G networks, and showcased it to visitors through BOE 110-inch 8K Ultra HD big screens.

8K display perfectly captured buildings, beach, sea, tourists, seagulls and other details, and presented the beauty of Barcelona to the visitors in real time.

On the brink of large-scale commercial use, 5G emerged as a hot topic during this year’s MWC. Mobile phones, edge computing, Internet of things and other fields closely related to 5G also received wide attention. Other 5G-based applications are shown in the following parts:

5G edition of Xiaomi Mi MIX3

Xiaomi was engaged in the research of 5G networking before 2017, and started the design of MIX3 5G version in 2017. The company began experimenting with 5G devices in June 2018 and successfully opened the 5G network in October.

The MIX3 5G version adopts the combination of Qualcomm Snapdragon 855 processor and Snapdragon X50 baseband. The Snapdragon X50 is the first baseband that supports 5G networks and speeds up to 5Gbps.

According to Xiaomi, the measured speed of the MIX3 5G version reaches over 2 Gbps. In the early stage of 5G development, Snapdragon played a significant role in the popularization of 5G concepts and applications. Up to now, Snapdragon X50 baseband has been installed in over 30 products.

Inspur OTII server for edge computing

Inspur released NE5260M5, the first OTII (Open Telcom IT Infrastructure) server for edge computing. NE5260M5 is designed for 5G scenarios such as IoT, MEC and NFV, and is suitable for the environment of the edge data center.

Chen Yanling, deputy general manager of Inspur server production department, mentioned that NE5260M5 meets the diverse standards for both server and telecom IT infrastructure, and was designed to open and unified standards for the edge data center environment and telecom applications.

In addition, NE5260M5 was designed to deliver the most advanced NUMA-Balance, QAT, remote management and debugging capabilities for edge computing. Inspur has been developing NFV, SDN and other application-specific technologies to achieve higher stability and lower latency in servers.

The world's first 5G baseband chip developed by Unisoc

Unisoc, a subsidiary of Tsinghua Unigroup, launched the 5G communication technology platform MAKULU and its first 5G baseband chip IVY 510. As one of the leading 5G core chip suppliers, Unisoc will bring much faster mobile broadband connections to global consumers, and boost the commercialization of 5G technology.

Unisoc’s IVY brand was brought to the public in 2018, which supports IoT products to build a connected society. And MAKULU, as the new 5G communication technology platform, will help power a huge rise in the Internet of Things. Unisoc plans to release a series of IVY products based on the Makalu technology platform in the near future.

According to public information, Ziguang Zhanrui released the IoT product brand, Ivy, in 2018, which helps the Internet of Everything. As a new 5G communication technology platform, Zikaru will continue to help the exhibition of the Ivy Internet of Things products to spread to 5G. In the near future, Ziguang Zhanrui will launch the Ivy product series based on the Makalu technology platform.

Another product announced by Unisoc at the MWC 2019 was IVY 510, the first 5G baseband chip based on the MAKULU technology platform, which is produced with TSMC's 12nm process. As the first 2G/3G/4G/5G multimode platform of UNISOC, IVY510 complies to the latest 3GPP R15 standard, supports Sub-6GHz 5G spectrum with a channel bandwidth of 100MHz, which is a highly integrated, high performance, low power 5G platform, and supports both standalone (SA) and non-standalone (NSA) network configurations to meet communication and networking requirements during different stages of 5G deployment.