Wuxi conference highlights new frontiers in city's semiconductor industry

The 2026 Integrated Circuit (Wuxi) Innovation and Development Conference opened on Aug 31 at the Wuxi International Conference Center, drawing nearly 500 industry leaders, including academicians, executives of leading semiconductor companies and heads of investment institutions.

The conference unveiled a range of new IC technologies and products from Jiangsu, including 2.5D/3D advanced packaging R&D platforms, silicon-based gallium nitride RF chips and high-resolution electron-beam defect inspection equipment — all targeting key links in China's semiconductor supply chain.

The event also saw the launch of several provincial innovation platforms. The Jiangsu Integrated Circuit Industry Alliance was established to connect leading companies, universities, research institutions and public technology platforms across the province.

The Jiangsu Key Laboratory of Advanced Process Materials for Integrated Circuits was put into operation, while two new laboratories, dedicated to 2.5D/3D heterogeneous integration, advanced substrates and power ICs for AI computing, were launched.

The conference will continue through Sept 2 with four themed events. The 8th Taihu IC Technology Innovation Summit will explore AI networking and advanced packaging, while the 2026 Automotive Chip Industry Innovation Ecosystem Conference will focus on closer integration between the automotive and semiconductor sectors. An AI PCB industry event in Xishan district will discuss building a competitive industrial cluster, while an industry investment meeting will bring projects and capital together.

The wider program also features forums, industry-academia exchanges, salons and new product launches.

Wuxi is home to about 70 percent of Jiangsu's leading wafer manufacturers, with monthly capacity exceeding 1 million 8-inch equivalent wafers. Its semiconductor ecosystem spans design, manufacturing, packaging, testing, equipment and materials.

The industry has continued to expand rapidly. In the first half of 2026, Wuxi's chip design sector generated 30 billion yuan ($4.46 billion) in revenue, up 47 percent year-on-year; wafer manufacturing reached 27.5 billion yuan, up 7.5 percent; and packaging and testing totaled 29.1 billion yuan, up 17.5 percent, said Huang Anjun, secretary-general of the Wuxi Semiconductor Industry Association.