Xiaomi launches three self-developed chips

Chinese tech company Xiaomi has unveiled three self-developed chips under its XRing brand at a technology briefing in Beijing, marking a major expansion beyond mobile system on chips into high-bandwidth AI acceleration and intelligent driving.

The trio comprises the XRing O3 flagship AI SoC for smartphones, the XRing O100 high-bandwidth AI accelerator, and the XRing D100 intelligent driving chip. All three have completed tape-out verification.

The XRing O3, Xiaomi's second-generation premium system on chip, is built on a 3nm process with 24 billion transistors — up 26 percent from its predecessor.

It is also the world's first mobile SoC to support Chinese memory chip maker ChangXin Memory Technologies' LPDDR6 memory. The O3 will debut in September on the Xiaomi 18 Fold smartphone, Xiaomi said.

The XRing D100 is China's first 3nm intelligent driving chip, featuring a 20-core CPU and 16-core NPU, supporting up to 160GB of unified memory and local deployment of 200-billion-parameter large models, Xiaomi added.

According to Xiaomi, the XRing brand has evolved from a single mobile system on chip into a full-ecosystem AI computing foundation, spanning "human, car, and home" scenarios. The O100 and D100 are scheduled for commercial deployment in 2027.